Polyurethane Polishing pads for semiconductor

Polyurethane polishing pads are commonly used in the semiconductor industry for chemical mechanical planarization (CMP), which is a process used to remove material from the surface of a semiconductor wafer to create a flat and smooth surface.

Polishing pads made from polyurethane offer a number of advantages over other materials. For example, they are durable and can withstand repeated use without losing their effectiveness. They are also resistant to chemicals and high temperatures, which makes them ideal for use in the harsh environments of semiconductor manufacturing.

In addition to their durability and resistance to chemicals and heat, polyurethane polishing pads are also known for their excellent polishing performance. They can be engineered to have different levels of hardness and surface textures, which can be tailored to specific polishing requirements.

When used with the appropriate slurry, polyurethane polishing pads can produce a high-quality, uniform finish on silicon wafers. They are also compatible with a variety of CMP equipment and can be easily replaced when they become worn or damaged.

Overall, polyurethane polishing pads are a popular choice for silicon wafer polishing because of their durability, chemical and thermal resistance, and excellent polishing performance.

Size:

PU Polishing Pads are available in full sheets or cut to size. Standard dimensions include 23 x 55 inches (584.2 x 1397mm), 36×71 inches (914x1803mm), 42×42 inches (1066x1066mm), 52×52 inches (1320x1320mm), Φ26 inches (660mm), Φ32 inches (812mm), Φ38 inches (965mm), Φ52 inches (1320mm). Custom sizes, shapes, and configurations are available.

Thickness: Polishing Pads range from 0.020 inch (0.508mm) to 0.20 inch (5.08mm).

PSA Backing: Pressure-Sensitive Adhesive (PSA) backing is available on all types of FST pads. PSA backing ranges from high-holding to low tack and easy release.

Grooving: Grooves improve pad performance by reducing excess slurry from the pad surfaces. The depth of a groove is usually half of the pad thickness, only a pad with a thickness of more than 2 mm can be grooved. The groove width is usually 2mm, and the island size is usually 16 x 16 mm. Our pad is offered in a variety of groove configurations.