Vitrified bond diamond grinding wheel for chips

A vitrified bond diamond grinding wheel is a type of grinding wheel that uses diamonds as the abrasive material and a vitrified bond to hold the diamonds together. It is specifically designed for chip grinding applications, where material removal is required by breaking off small chips or fragments from the workpiece.

Vitrified bond wheels are made by mixing diamond grit with a bonding material, such as ceramic, glass, or vitrified clay. The mixture is then shaped into the desired wheel form and fired at high temperatures to bond the abrasive particles together.

The diamond abrasive in a vitrified bond wheel is extremely hard and has excellent wear resistance, making it suitable for grinding hard and brittle materials like ceramics, glass, and carbide. The vitrified bond provides good holding strength, thermal stability, and chemical resistance, ensuring the diamond grit remains securely in place during grinding.

In chip grinding applications, the vitrified bond diamond grinding wheel is used to remove material by breaking off small chips or fragments from the workpiece. It is commonly used in industries such as tool and die making, precision machining, and semiconductor manufacturing, where precise material removal and surface finish are crucial.