Bond types

Resin bond

• For grinding tungsten carbide and steel materials

• High material removal volumes at low grinding forces

• For wet and dry grinding

• High flexibility by mixing in suitable additives

Metal bond

• Highest wear resistance and profile retention

• High effective forces and therefore lower material removal

volume in comparison to synthetic resin bonds

Vitrified bond

• Used to manufacture abrasive coatings with defined porosities for an extremely wide range of applications

• Especially good dressing and profiling capability, optimally suited for the conditioning of diamond dressing rollers in particular

• Lower wheel wear, low grinding forces for high quality Work-piece surfaces

Electroplated bond

• Electrolytic depositing through a layer of grain on a metallic body

• Very high grip for the highest possible grinding performance

• For pre-grinding complex profiles with high material removal volumes

• For finishing grinding with high precision, for example in the gear-cutting industry